|Enables space saving, tested solutions for mobile devices|
| September 26, 2013 – Pulse Electronics Corporation (NYSE: PULS), a leading provider of electronic components, now announces in-house capability to integrate passive surface mount technology (SMT) components on 3D laser direct structuring (LDS) antennas. Incorporating SMT components with the 3D LDS antenna structure saves space on the mobile device’s printed circuit board and optimizes the use of available space on the antenna. The antenna can be matched and tested as one RF unit prior to phone assembly and frequency variants, tuning, and late optimization changes can be done quickly and cost effectively. This avoids costly rework or rebuild of the mobile device’s main PCB and improves time-to-market.|
“In some mobile device designs, in order to achieve the best performance within the given volume and to have a better degree of freedom to tune the antenna, SMT components need to be integrated to the antenna radiator. Pulse’s new technology combines traditional SMT processing with 3D LDS,” said Maritta Timosaari, marketing director, Pulse Electronics Wireless Division. “During the manufacturing cycle, standard lead-free SMT passive matching components, such as inductors, capacitors, and connectors, are assembled on the antenna. Benefits of this solution are even more significant when realizing more complex RF designs.”
Pulse Electronics’ LDS antennas are high-performance RF antennas. LDS is a 3D antenna manufacturing technology created when a laser beam transfers the antenna design directly onto a molded 3D surface.
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